TRUMPF makes glass substrates ready for the next generation of AI chips
TRUMPF makes glass substrates ready for the next generation of AI chips The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a…
Best Mart 360 Reports Interim Revenue Growth to HK$1.45 billion
Best Mart 360 Reports Interim Revenue Growth to HK$1.45 billion Proposed an interim dividend of HK11.0 cents per share Highlights: Revenue increased to approximately HK$1,450.9 million. Gross…
Ingdan, Inc. (400.HK) Announces 2026 Interim Results
Ingdan, Inc. (400.HK) Announces 2026 Interim Results Highlights of the Interim Results for the Six Months Ended June 30, 2026: Benefiting from sustained strong chip demand across the AI data…
PolyU develops quantum-tunnelling field-effect transistor to overcome barriers to integrated-circuit chip development
PolyU develops quantum-tunnelling field-effect transistor to overcome barriers to integrated-circuit chip development HONG KONG SAR – Media OutReach Newswire – 31 August 2026 – The next…
